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Brussels LeadFree Conference PROGRAM |
Brussels
LeadFree Conference
EDUCATION COURSES |
SPONSORSHIP OPPORTUNITIES | REGISTRATION Download pdf form |
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Now that the EU RHS Directive
(Restriction of Hazardous Substances in Electrical and Electronic Equipment)
has been published, all affected electrical equipment put on sale in Europe
after July 1, 2006 will be required to be lead free. All suppliers, assemblers
and retailers need to be aware of the current situation in order to achieve
lead free product sales by 2006. To help the industry prepare
for this momentous change, IPC—Association Connecting Electronics
Industries and SOLDERTEC— a division of Tin Technology are sponsoring
a Global Conference on Lead Free Electronics, to take place June 10, 2003,
in Brussels, Belgium. IPC and SOLDERTEC will bring the industry’s
top experts together for Europe’s first major conference on this
subject. This ban in Europe will affect the global marketplace, forcing all manufacturers to eliminate lead as effectively as a local ban— manufacturers in all regions, including North America and Asia, will need to prepare for this change. Producers of equipment, not directly affected by the legislation e.g. aerospace, need to assess the effects of changes in the supply chain and customer demand. Prior to the technical conference, in-depth educational courses will be offered to enhance your knowledge on a variety of lead free issues. Don’t miss this historic opportunity. Register now. |
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T-01 John H. Lau This course provides the fundamental
principles, engineering data and cutting edge research on the most important
developments and latest results to help you apply the lead free, halogen
free, and conductive adhesives technologies. For professionals involved
in high density interconnections that demand a cost effective design and
high-yield environmentally benign manufacturing processes, this course
will provide the facts necessary for manufacturing implementation. Topics
to be Covered
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W-01 Jennie Hwang, Ph.D. Government regulations restricting
lead usage have caused a surge in interest in lead free manufacturing.
New process demands, coupled with the evolution of advanced IC packages
(BGA, CSP, Flip Chip) requiring higher performance, pose critical challenges
for electronics manufacturing. This course will provide a clear understanding
of lead free solders from application perspectives and present selection
criteria for lead free compositions. Topics to be Covered
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W-02 Jennie Hwang, Ph.D The properties and performance
of PCB surface finishes and the component lead coating/terminations are
important to the PCB assembly’s long-term integrity as well as to
the SMT production yield. This course will provide the factors that determine
the solderability and performance of lead free surface finishes and component
coatings from both chemical and metallurgical aspects. The material and
process options and the pros and cons of various material/process systems
will be discussed. Topics
to be Covered
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W-03 Gerjan Diepstraten The lead free reflow process window is tighter than the soldering process window for tin lead assemblies. Achieving a reflow process that does not exceed the maximum peak temperature rating of the various materials BUT also achieves the minimum peak temperature necessary to form that reliable joint is critical. Simultaneously, other reflow process parameters such as the preheat condition, time above liquidus, and cooling conditions are equally essential in delivering a high yield electronic product. Using selective soldering can help manufacturers solve these conflicting needs. This course will review every aspect of the process, from fluxing and preheating to solder wave types needed for lead-free assemblies. Topics to be Covered
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W-04
Werner Engelmaier Reliability is a real concern in the use of lead free solders. In this course, solder attachment, printed circuit board substrate and component reliability threats will be discussed and strategies will be presented to assure reliability. Treats will be detailed as to the load drivers and the resulting failure modes and illustrated by pertinent examples. Further, issues arising from the required higher soldering temperatures and the metallurgy of lead free solders will be highlighted. Adequate reliability of surface mount solder attachments can only be assured with an understanding of all the factors impacting the loading conditions on the solder joints. Solder creep-fatigue behavior as well as the different load drivers such as thermal cycling, vibration, and mechanical shock will be discussed. Available information for lead free solders fatigue behavior of tin-lead (Sn/Pb) solders will be put into context with the appropriate testing to assess the extent of these various reliability strategies for solder attachments, printed circuit boards, and components. Topics to be Covered
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IPC and Soldertec are offering the
following sponsorship opportunities for the International Conference
on Lead-Free Electronics "Towards implementation of the RHS Directive,"
being held in Brussels, Belgium, June 10-12.
Hosting
a Luncheon
Hosting All
Day Refreshments
Distribution
of Literature (on a general table top)
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